Product Information
GMP-LP Series for Lapping & Polishing
Product Brief
GMP-LP1
Monocrystalline micro diamond powder, high purity, isomorphic particle shape, narrow particle size distribution.
GMP-LP3
Polycrystal-like structure with hardness between monocrystalline and polycrystalline diamond, providing excellent dispersibility, wear resistance, and stable suspension in aqueous or organic slurries. Its surface features dense and fine cutting edges which enhance sharpness, ensuring consistent material removal and long life span.
Available Particle Sizes:
Application recommend
GMP-LP1 is used to produce polishing paste and polishing suspension. Due to its excellent sharpness, there is no scratch during polishing, and thus workpiece surface accuracy can be improved. It is widely used in the processing of ceramics, wire drawing dies, PCD, optical glass, semiconductor, etc.
GMP-LP3 is designed for thinning and polishing stages of hard and brittle materials, including monocrystalline silicon, ceramic substrates, sapphire wafers, and compound semiconductors. It ensures a high removal rate while minimizing scratches, delivering excellent surface finish with an optimal balance of efficiency and quality.